Facilities & Equipment

Production Facilities

  • Solder Printer

    Model Capacity Feature
    SMP-300 Print Speed : 8 sec
    50X50~460X400mm    		 Applicable
    Various Mask Size

  • SPI

    Model Capacity Feature
    HS-60 60 ㎠/sec
    50X50~390X260mm    		 -

  • Pick & Place

    Model Capacity Feature
    SM-411 Chip 30,000 [CPH] (IPC9850)
    50X40~510X460mm    		 Dual Lane &
    Gantry 6 Head X 2
    SM-421 Chip 21,000 [CPH] (IPC9850)
    QFP 55,000 [CPH] (IPC9850)
    50X40~460X400mm    		 Chip 0603mm
    BGA 42~55SQ

  • Reflow

    Model Capacity Feature
    1810MKIII 50~430mm 10 Zone
    N2 Flow
    (1000 PPM @200mm Open)

  • AOI

    Model Capacity Feature
    MV-8VH Available minimum size : 1005
    50X50~510X460mm    		 50(W)×50(D)~
    510×410 mm
Solder Print & SPI
Reflow
Pick & Place
AOI

  • Solder Printer

    Model SMP-300
    Capacity Print Speed : 8 sec
    50X50~460X400mm
    Feature Applicable
    Various Mask Size

  • SPI

    Model HS-60
    Capacity 60 ㎠/sec
    50X50~390X260mm
    Feature -

  • Reflow

    Model 1810MKIII
    Capacity 50~430mm
    Feature 10 Zone
    N2 Flow
    (1000 PPM @200mm Open)

  • Pick & Place

    Model SM-411
    Capacity Chip 30,000 [CPH] (IPC9850)
    50X40~510X460mm
    Feature Dual Lane &
    Gantry 6 Head X 2
  • Model SM-421
    Capacity Chip 21,000 [CPH] (IPC9850)
    QFP 55,000 [CPH] (IPC9850)
    50X40~460X400mm
    Feature Chip 0603mm
    BGA 42~55SQ

  • AOI

    Model MV-8VH
    Capacity Available minimum size : 1005
    50X50~510X460mm
    Feature 50(W)×50(D)~
    510×410 mm

  • Flying Probe Tester

    • In-Circuit Test
    • Short Test
    • Open Pin Scan
    • Optical Test

  • X-Ray Inspection

    • Via Hole(Open, Crack, Etc.)
    • Ball(Void Crack, Short, Etc.)
    • Wire Bonding

  • SMD Rework Station

    • BGA, LGA Rework
    • All Type I.C Rework
    • N2 Type M/C